Qualcomm Technologies, Inc - Experts & Thought Leaders

Teledyne FLIR, part of Teledyne Technologies Incorporated announced Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism™ AI and computational imaging at the edge. The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the pioneer in mobile, automotive, and robotics system-on-chip (SoC) technology. AI performance The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems. AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson® and Neutrino® thermal infrared imaging camera modules and a wide range of popular visible cameras. Prism AI and ISP software Prism AI is a powerful perception software designed to detect, classify, and track targets or objects Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security.  Prism ISP is a comprehensive set of image processing algorithms that include super-resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local contrast enhancement, and noise reduction. SWaP-optimised processor “The new AVP is the most powerful and SWaP-optimised processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, vice president of product management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.” Simplify and streamline development The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

Advantech proudly announced its strategic collaboration with Qualcomm Technologies, Inc. to revolutionise the edge computing landscape. This effort, combining AI expertise, high-performance computing, and pioneer connectivity, is set to propel innovation for industrial computing. This collaboration establishes an open and diverse edge AI ecosystem, paving the way for best-in-class solutions tailored to AIoT applications. Enabling seamless integration Miller Chang, President of EIoT at Advantech, elaborates: “In the vast and fragmented IoT landscape, deploying AI applications efficiently is a challenge. Advantech and Qualcomm Technologies are working together to meet market demands and surpass perceived limits. Advantech, in collaboration with Qualcomm Technologies, will look to provide edge AI platforms to navigate the industry's fragmentation, ensuring interoperability. Together, we aspire to redefine AI possibilities at the edge, shaping the future of edge intelligence." "Advantech and Qualcomm Technologies’ collaboration marks a significant milestone in the evolution of edge computing. By combining Advantech's expertise in industrial computing with our cutting-edge technology, we are poised to reshape the future of embedded systems. This collaboration will unlock new possibilities for AIoT applications, enabling seamless integration of AI-powered solutions at the edge. We are excited to be part of this journey and look forward to the transformative impact it will have on various industries," said Jeff Torrance, Senior Vice President and General Manager, Industrial and Embedded IoT, Qualcomm Technologies, Inc. Performance-intensive technology Qualcomm Technologies is pioneering the industry transformation at the edge Qualcomm Technologies is pioneering the industry transformation at the edge. Utilising its Product Longevity Program for certain SoCs, advancing AI technology and connectivity systems, Qualcomm Technologies envisions benefits across industrial automation, transportation, medical, and rapidly evolving sectors like robotics and energy. The collaboration between Qualcomm and Advantech reinforces the technical expertise and dedication to innovation of both companies. Advantech’s goal is to develop an advanced lineup of Edge AI Platforms and a dedicated Edge AI SDK for edge AI applications. These standardised and diverse platforms will drive the tasks of the future that will rely increasingly on intelligent and performance-intensive technology. Driving continuous innovation Through this collaboration, Advantech is poised to integrate Qualcomm Technologies’ solutions across its entire platform spectrum, including AI-on-Modules, AI Function Boards, and AI Edge Systems. Both companies will help develop go-to-market strategies to accelerate the digital Transformation of the embedded industry. This collaboration aims to drive continuous innovation and expansion in Edge AI devices for IoT.

IDEMIA Secure Transactions (IST), a division of IDEMIA Group, is a major provider of payment and connectivity solutions for financial institutions, mobile network operators and automotive manufacturers. It has established itself as a leader in secure payment solutions for Central Bank Digital Currencies (CBDCs). This work with Qualcomm Technologies confirms IST’s ambition to offer increasingly innovative payment solutions to customers around the world. IDEMIA Secure Transactions completes its offering IDEMIA Secure Transactions has already demonstrated offline CBDC on a variety of payment devices IDEMIA Secure Transactions thus completes its offering, enabling them to make payments securely and seamlessly, with the device of their choice, from traditional bank cards, biometric cards, wearables to feature phones, smartphones, or connected watches. In previous projects with central banks, IDEMIA Secure Transactions has already demonstrated offline CBDC on a variety of payment devices. With this new project, it demonstrates offline payment protocol, and the associated credentials handling, done by an integrated secure element already available in users’ phones, meaning safer and easier offline transactions for them. An innovative strategy to facilitate the deployment of offline CBDC payments By joining forces with Qualcomm Technologies, IST will enable OEMs to allow millions of users to make offline payments with CBDCs via their smartphones, thanks to the Qualcomm® Secure Processor Unit (SPU), a highly secure computing environment integrated into the Snapdragon 8-series. Qualcomm Technologies’ products and solutions are behind and inside the innovations that deliver significant value across multiple industries and to billions of devices. This innovation is a real game-changer for the payment industry, as over 90% of central banks are developing digital currencies. This collaboration has the potential to revolutionise payment habits and make life easier for a huge number of consumers. Unrivalled security for offline payments IDEMIA Secure Transactions is recognised globally as an expert in payment security IDEMIA Secure Transactions is recognised globally as an expert in payment security, and when it comes to offline payments, security is particularly important, as validation by a server is not possible. Therefore, a secure element must be issued specifically for that need to prevent double-spending and unauthorised money creation. The Snapdragon 8 Mobile Platform together with IST’s solution makes it possible to deploy offline CBDC on a smartphone equipped with that chip, dynamically in the field, easily and seamlessly. This happens without compromise on security, thanks to the use of the Qualcomm SPU, a highly secure zone of the phone’s application processor, designed to better resist to state-of-the-art security attacks. IDEMIA and Qualcomm partnership Jerome Ajdenbaum, Vice President (VP) - Digital Currencies at IDEMIA Secure Transactions, said “True to our commitment to make secure offline CBDC work anywhere, anytime and for everyone, we are very proud to collaborate with Qualcomm Technologies, one of the world’s most innovative companies.” He adds, “This new payment solution underlines IDEMIA Secure Transactions’ ability to marry frictionless deployment with ever more secure technologies, with the primary aim of making users’ life easier. We are looking forward to working with central banks and the mobile OEMs to deploy these solutions all around the world.” Easy integration for OEMs Asaf Shen, Senior Director, Product Management, Qualcomm Technologies, Inc. said “Leveraging the Qualcomm SPU on the Snapdragon 8-series Mobile Platforms helps to make offline CBDC payments more secure and allows for easy integration for OEMs.” He adds, “In fact, the smartcard certification achieved for SPU means it is resistant to attacks performed by an attacker possessing High attack potential, which is the highest level. We look forward to OEMs deploying offline CBDC and simplifying the life of users.”