Teledyne FLIR, part of Teledyne Technologies Incorporated, has announced the new ISC1504, ISC1901, and ISC1902 10-micron pitch readout integrated circuit (ROIC) devices.
These devices join the lineup of near-infrared (NIR), mid-wavelength infrared (MWIR), and long-wavelength infrared (LWIR) devices in off-the-shelf ROIC solutions designed for applications ranging from academic research to the most demanding military infrared systems.
ISC1504
At 1920 x 1080 resolution, the ISC1504 is the largest format ROIC offered by Teledyne FLIR optimised for InGaAs/VisGaAs detectors and uses a capacitive trans-impedance amplifier (CTIA) input circuit for P-on-N detectors.
The ISC1504 supports anti-blooming, input skimming, multiple integration modes, and selectable output modes. A simple user interface with analogue outputs allows for easy integration into high-resolution systems.
ISC1901and ISC1902
Both support single sample or sub-frame averaging for an effective well fill of 3M to 19M electrons
The ISC1901 (2048 × 1536 resolution) and the ISC1902 (2048 × 2048 resolution) are designed for P-on-N detectors with a direct injection input circuit. Both support single sample or sub-frame averaging for an effective well fill of 3M to 19M electrons, respectively.
The setting selections allow the user to control various modes such as 2 × 2 binning, 8 or 16 output channels, and additional reverse bias for Quantum Well Infrared Photodetector (QWIP) detectors. The familiar user interface from Teledyne FLIR makes system integration straightforward.
Mixed-signal ROICs
All ROIC devices are probe tested and delivered in wafer form with test data, a user’s guide describing all electrical interfaces, and a mechanical interface database providing the layout information for bump and detector interfaces.
With low noise, variable charge storage capacitance, selectable integration times, adjustable gain and power settings, and a simple user interface, Teledyne FLIR mixed-signal ROICs offer a proven, cost-effective design without sacrificing performance or flexibility. Additionally, Teledyne FLIR offers full custom ROIC design services covering trade study, specification, design, testing, and fabrication of wafers.
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