SESAMES Award recognises the industry’s innovative technological applications in the field of smart cards, digital security, secure transactions, and contactless technology
HID iCLASS Seos's universal card edge feature supports multiple technologies

HID Global, a worldwide leader in secure identity solutions, recently announced that its iCLASS Seos credential has won the Asian SESAMES Award in the software and applications category.  The award recognises the industry’s most innovative technological applications developed for the Asia Pacific market in the field of smart cards, digital security, identification, secure transactions, and contactless technology. Judges include industry experts who evaluated entries during the competition and the Asian SESAME award marks HID Global’s thirteenth accolade for its iCLASS SE platform solution by the industry’s most influential security organisations and publications worldwide.

“As HID Global’s latest addition to our award-winning iCLASS SE platform, iCLASS Seos reinforces our Genuine HID commitment to deliver new capabilities for meeting current and future secure identity requirements,” said Selva Selvaratnam, senior vice president and chief technology officer with HID Global. “HID Global is honoured to be recognised by the Asian SESAMES Award committee. The award further validates our dedication to continually support customers with innovative solutions for a broad range of applications using a combination of smart cards, microprocessor cards and NFC-enabled mobile devices.”

iCLASS Seos features a standards-based universal card edge, which supports multiple technologies and future technologies for maximum interoperability. The credential is portable for use on NFC smartphones while providing data confidentiality and strong authentication with state-of-the-art cryptography for mutual authentication and data encryption that protects the privacy of contactless communications.

HID Global is demonstrating its iCLASS Seos credential at CARTES Asia Secure Connexions Event in Hall 3, booth #3C017 at the Hong Kong Asia-World Expo through March 28, 2013.

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